Composite heat-insulating materials based on a ceramic-forming organosilicon binder

The possibility of using hollow ceramic microspheres and an organosilicon binder with silane and carbosilane bonds to obtain heat-resistant heat-insulating ceramic foam materials for structural purposes is considered. The influence of the filler and the gas medium on the products of thermal destruction and the properties of the composition is shown. Thermophysical and physical-mechanical characteristics of the heat-insulating material are given. Tab. 3, ill. 2, bibliography: 4 titles.