The possibility of partial or complete replacement of PbO in low-melting glass solders with less toxic components has been investigated. It was found that in systems PbO - P 2 O 5 - ZnO - B 2 O 3 , V 2 O 5 - P 2 O 5 - ZnO - B 2 O 3 and TeO 2 - PbO - V 2 O 5 - Bi 2 O 3 with various additives with a total mass content of components of the first hazard class no more than 70%, it is impossible to find a full replacement for glasses in lead-borate eutectic used as a glass base in glass-soldering compositions intended for sealing glass-ceramic cases of integrated circuits at a temperature of 390 - 420 ° C. Tab. 3, bibliography: 7 titles.
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