A new technology of laser blunting of sharp edges of glass and other brittle non-metallic materials by forming a chamfer due to the removal of a sharp edge of the material under the influence of thermal stresses is described. A physical model of the process of laser heating of the edge of a material opaque for laser radiation is proposed. The relationship has been established between the main parameters of the process: the dimensions of the chamfer, the speed of chamfering, the power of laser radiation and the strength of the edge of the glass. Optimization of technological modes has been carried out, a technological process and laser equipment for cutting and chamfering from glass have been developed. The advantages of the new technology of laser chamfering from glass are shown in comparison with the traditional technology of chamfering using a diamond abrasive tool.
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Kondratenko VS, Ivanov VI Technology of laser cutting of silicon wafers into crystals of organic light-emitting diodes // Russian technological journal. 2016.Vol. 4.? 3.S. 11? 17.
Pat. RF 2163226. Method of blunting sharp edges of products (Options) / VS Kondratenko; by application 2000116613 dated 06/28/2000. Publ. 02/20/2001. // Bul. 2001.? 5.
Pat. RF 2426700. Method of blunting sharp edges of products / VS Kondratenko, AS Naumov; by application 2009134857 dated 09/18/2009. Publ. 08/20/2011 // Bul. 2011.? 23.
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