Formation of silicium crystalline structure in active media during polishing

Under the action of surfactants included in the polishing compositions, due to the manifestation of the Rebinder effect, the initial crystal structure of the thinnest (tenths and hundredths of a micrometer) surface layer of the processed material (silicon) is severely destroyed and its deformation and strength properties change. The use of active additives to polishing compositions, including unconventional ones, makes it possible to reduce the thickness of the damaged layer by 1.5 - 2 times, while significantly increasing the productivity of polishing.