In this work we studied the influence of the laser exposure parameters and the etching solution type on the hollow channels length formed in silica glass by femtosecond laser-assisted backside wet etching. The pro-posed multi-pass method significantly increased the channel length up to 180 µm. Using the etching solu-tions, which effectively dissolve the defective layer of the formed channels, makes it possible to obtain deeper and wider hollow channels with high selectivity
T. O. Lipateva1, A. S. Lipatiev1, Ya. V. Kulakova1, S. V. Lotarev1, S. S. Fedotov1, I. V. Prusova2, V. N. Sigaev1
1Mendeleev University of Chemical Technology (Mendeleev University) (Moscow, Russia)
2Belarusian National Technical University (BNTU) (Minsk, Belarus)
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